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| Products>Tacky Soldering Flux>TSF-6592 | |||||
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| 300303Tacky Soldering FluxKester TSF-6592 is a no-clean paste flux designed as a lead-free solution for an array of lead-free interconnect applications such as flip chip attach, sphere or ball attach, rework/repair of CSPs, BGAs, SMDs, or any lead-free soldering application that requires a very tacky flux. |
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