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R276
R-276 Sn63Pb37 87% T3 (-325+500) No Clean Solder Paste 100 Gram Syringe
Mfgr Part No: 70-1607-0504
In Stock: 0 (Available To Order)
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R-276 Sn63Pb37 87% T3 (-325+500) No Clean Solder Paste 35 Gram Syringe
Mfgr Part No: 70-1607-0520
In Stock: 0 (Available To Order)
Price: Request Quote
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R-276 Sn96.5Ag3.0Cu0.5 86% T3 (-350+500) Lead Free No Clean Solder Paste 35 Gram Syringes
Mfgr Part No: 70-1608-0820
In Stock: 1
Price: Request Quote
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R276



No Clean Paste

Kester R276 is a no-clean solder paste specifically designed for optimal characteristics in all types of dispensing applications. R276 is packaged void-free to insure consistent dispensing in high speed automated processes. R276 is available in Sn63Pb37 and Sn96.5Ag3.0Cu0.5 alloys. The flow characteristics of R276 provide for excellent dispensing characteristics with a wide range of needle diameters.