8.9HF Sn63Pb37, No Clean, Halogen-Free, -400+635 (T4), 89.5%, Solder Paste 600 Gram Cartridge (800550) Mfgr Part No: PASTEOT-800550-600C In Stock: 44 Price: Request Quote
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8.9HF Sn95.5Ag3.8Cu0.7, No Clean, Lead-Free, -325+500 (T3), 89%, Solder Paste 500 Gram Jar Mfgr Part No: PASTEOT-800592-500J In Stock: 0 (Available To Order) Price: Request Quote
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8.9HF Sn96.5Ag3.0Cu0.5, No Clean, Halogen-Free, Lead-Free, -325+500 (T3), 89%, Solder Paste 1000 Gram Cartridge (800494) Mfgr Part No: PASTEOT-800494-1000G In Stock: 44 Price: Request Quote
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8.9HF Sn96.5Ag3.0Cu0.5, No Clean, Halogen-Free, Lead-Free, -325+500 (T3), Solder Paste 500 Gram Jar Mfgr Part No: PASTEOT-800494-500G In Stock: 0 (Available To Order) Price: Request Quote
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8.9HF Sn96Ag3.0Cu0.5, No Clean, Halogen Free, -400+635 (T4), 88.5%, Solder Paste 600 Gram Cartridge (800495) Mfgr Part No: PASTEOT-800495-600C In Stock: 0 (Available To Order) Price: Request Quote
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8.9HF Sn96Ag3.0Cu0.5, No Clean, Halogen Free, -400+635 (T4), 88.5%, Solder Paste 700 Gram Proflow Cassette Mfgr Part No: PASTEOT-800495-700GPF In Stock: 0 (Available To Order) Price: Request Quote
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8.9HF Sn96Ag3.0Cu0.5, No Clean, Halogen Free, -400+635 (T4), 88.75%, Solder Paste 500 Gram Jar (800662-JAR) Mfgr Part No: PASTEOT-800662-500J In Stock: 0 (Available To Order) Price: Request Quote
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8.9HF Sn96Ag3.0Cu0.5, No Clean, Halogen Free, -400+635 (T4), 88.75%, Solder Paste 600 Gram Cartridge (800662) Mfgr Part No: PASTEOT-800662-600C In Stock: 0 (Available To Order) Price: Request Quote
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8.9HF
Lead Free Solder Paste
Indium8.9HF is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by the electronics industry to replace conventional Pb-bearing solders. Indium8.9HF offers unprecedented stencil print transfer efficiency to work in the broadest range of processes. In addition, the high probe testability of Indium8.9HF minimizes false failures in ICT. It is one of our lowest voiding pastes.
Features
Halogen-free per EN14582 test method
Low BGA, CSP, QFN voiding
One of our most stable pastes
High transfer efficiency through small apertures (≤ 0.66AR)
Eliminates hot and cold slump
High oxidation resistance
Wets well to oxidized BGA and pad surfaces
Excellent soldering performance under high temperature and long reflow processes
